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Paste for Chip Component

칩바리스터용 페이스트

Product Code %of Solid Powder Viscosity Work Condition Composition Characteristics Attachment
S-1270 69~72wt% 51~69kcps 770~790℃ Ag Good plating Termination
G-1130J 76~80wt% 80~120kcps 690~700℃ Glass Shield
S-1165 80~82wt% 55~75kcps 610℃×10min Ag Good Sintering Density, Good Plating Performance

칩레지스터용 페이스트

Product Code %of Solid Powder Viscosity Work Condition Composition Characteristics Attachment
SP-1400A(H) 75~77wt% 330~380kcps 850℃ Ag, Pd Front side
S-1400B 78~80 wt% 230~280kcps 850℃ Ag Front side
S-1400AH 76~78 wt% 320~380kcps 850℃ Ag Front side

칩인덕터용 페이스트

Product Code %of Solid Powder Viscosity Work Condition Composition Characteristics Attachment
S-1535L6 73~75 wt% 40~50kcps Ag Termination
S-1516 84~86 wt% 850~920℃ Ag Inner, Medium Q &Low Rdc, printing
S-1513J 88~90 wt% 237~327kcps 850~920℃ Ag Inner, Power Inductor
S-1512J 88~90 wt% 195.5~264.5kcps 850~920℃ Ag Inner, Power Inductor
S-1506B 79~81 wt% 850~920℃ Ag Inner, Medium Q &Rdc, printing
S-1506 79~81 wt% 850~920℃ Ag Inner, Medium Q &Rdc, printing
S-1505H 87~89 wt% 155~205kcps 850~920℃ Ag Inner, Medium Q &Low Rdc, printing
S-1502 84~86 wt% 850~920℃ Ag Inner, Medium Q &Low Rdc, printing
S-1500N 83~85 wt% 130~160kcps 850~920℃ Ag Inner, Medium Q &Rdc, printing

기타

Product Code %of Solid Powder Viscosity Work Condition Composition Characteristics Attachment
S-2240 79~81 wt% 28~34kcps 200℃×50min Ag Curing Type
S-2200J 72~77 wt% 35~38kcps 180℃×30min Ag Curing Type
S-1162M 78~82 wt% 36.5~49.5kcps Ag Chip Termination
S-1133AS 75.5~77.5 wt% 55~75kcps Ag Chip Termination
S-1130S6 78~82 WT% 20~50kcps 700~750℃ Ag Lead Free, Termination